Electronic component reliability: fundamentals, modelling, evaluation, and assurance
Using a unique approach, the author examines both reliability physics and reliability statistics to reveal how they can be employed in order to discover why components fail and how failures develop over time. The text introduces several important reliability concepts and then divides into three key areas--modelling, evaluation and assurance.
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Reliability Physics and Failure Mechanisms
Mixed Distributions and Multiple Failure
12 other sections not shown
accelerated lifetests activation energy aluminium analysis assembly ball bond batch bility breakdown bum-in burn-in causes Chapter chip CMOS component failure component lifetime component strength constant hazard rate corrosion cracking curve damage described devices discussed electromigration electronic components electrostatic discharge environment evaluation example exponential distribution extrinsic failures failure mechanisms failure modes failure pattern field failures freak loads illustrated infant mortality failures integrated circuits Intel Intel Corporation intrinsic reliability latch-up lifetime distribution lifetime patterns loading conditions log-normal distribution long-term wearout macro defects manufacturing median lifetime MTTF nent normal distribution oxide parameter performed period plastic package population printed circuit board probability density function problem Quality and Reliability relia Reliability Engineering International reliability indicator robustness sample screening semiconductor shown in Figure shows silicon situation socket statistical strength distribution stress Table technique temperature thermal tion transistor voltage Weibull distribution whilst wire bond