Microfabricated Systems and MEMS VII: Proceedings of the International Symposium

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Jimmy Lee Davidson
The Electrochemical Society, 2004 - Technology & Engineering - 340 pages
 

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Page 1 - School of Electrical and Computer Engineering Georgia Institute of Technology, Atlanta, GA 30332, USA.
Page 323 - Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000.
Page 173 - Research Institute University of Twente, PO Box 217, 7500 AE Enschede, The Netherlands Abstract.
Page 241 - J. Fritz, MK Bailer. HP Lang, H. Rothuizen, P. Vettiger, E. Meyer, H.-J. Guntherodt, Ch. Gerber, JK Gimzewski, "Translating Biomolecular Recognition into Nanomechanics", Science, 288, 316-318 (2000). 6. GY Chen, T. Thundat, EA Wachter, and RJ Warmack, "Adsorption-induced surface stress and its effects on resonance frequency of microcantilevers", J.
Page 80 - A compendium of data for the biomedical engineer and physiologist," Medical and Biological Engineering, vol.
Page 80 - Visual perception elicited by electrical stimulation of retina in blind humans,
Page 201 - Japan * Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University...
Page 7 - Portions of the work described in this paper were supported by the National Institutes of Health and the Defense Advanced Research Projects Agency.
Page 221 - ... hence PZR, apparently has a maximum at moderate doping levels at 25C. Pressure Sensor Fabrication, Measurement. Polycrystalline diamond films for the pressure sensor were grown using an ASTeX (from ASTeX, Inc., Woburn, MA) microwave plasma assisted chemical vapor deposition diamond deposition system. Typical process parameters for the growth of these films were: pressure, 40 torr; substrate temperature, 850C; gas flow rate, 500 sccm hydrogen and 5 sccm methane; microwave power, 1500 watts....
Page 56 - S. Bahadur, The growth and bonding of transfer film and the role of CuS and PTFE in the tribological behavior of PEEK.

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