Proceedings of the ... International Symposium on Microelectronics, Volume 4587International Society for Hybrid Microelectronics, 2001 - Hybrid integrated circuits |
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adhesive antenna aperture applications array assembly ball bond bond pad capacitance capacitor ceramic circuit co-fired components conductivity conductor copper crack delafossite density developed devices diameter die attach dielectric constant effect electrical electronic embedded etching evaluation fabricated filter flip chip flux frequency function heat sink IEEE IMAPS increase inductors integrated interconnection interface laminated layer LTCC material measured MEMS metal micromachined microstrip microwave module mosfet mounting multilayer parameters passive pattern performance phase pitch plate polyimide Polymer Collar printed reflow reliability resin resistance resistors resonant sample semiconductor sensor shear shown in Figure shows silicon simulation sintering solder ball solder bumps solder joint solder paste stencil stress structure substrate surface tape TBGA packages temperature thermal cycling thick film thin film ultrasonic underfill wafer width wire bonding wire sweep wire wick