Nanoindentation

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Springer, Jan 1, 2002 - Technology & Engineering - 197 pages
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As the focus in materials science shifts towards designing materials at the sub-micron scale - the nanotechnology revolution - it becomes increasingly important to characterize the mechanical properties of thin films and small volumes of material. The development of of nanoscale probes and ultrasensitive transducers for force and depth has made such measurements possible, and there are several commercially available instruments for making them. Such nanoindentation measurement devices are used in a wide variety of research and manufacturing areas, ranging from the fabrication and testing of silicon wafers in the electronics industry to the testing of hard coatings for cutting tools. This book presents the underlying theory behind the extraction of elastic modulus and hardness from the load-displacement data, discusses the significance of surface forces and adhesion, delineates the various corrections involved, and describes the methods of operation of the available instruments.

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Contents

Contact Mechanics
1
Nanoindentation Testing
20
Analysis of Nanoindentation Test Data
36
Copyright

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About the author (2002)

Anthony C. Fischer-Cripps, Ph.D. is the Project Leader for Surface Mechanics, Telecommunications & Industrial Physics at Commonwealth Scientific & Industrial Research Organization in Lindfield, Sydney, Australia.

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