Materials Science of Microelectromechanical Systems (MEMS) Devices IV:
Arturo A. Ayón
Cambridge University Press, May 23, 2002 - Technology & Engineering - 318 pages
Microelectromechanical systems (MEMS) has been able to successfully acceded to several markets, including pressure sensors, gyroscopes, accelerometers, fluidics and data storage, representing a total revenue of some $2 billion in 2000. However, MEMS has the potential to offer reliable and cost-effective solutions to many other fields. The current expectation is that we will witness the appearance of diverse MEMS structures for power generation, propulsion, biomedical applications, optical switching, infrared sensing, microphones and displays, to name just a few. This plethora of activity is possible due to the increased understanding of the properties of the micromanufacturing materials involved, the availability of processing equipment with enhanced capabilities, and the effort of a large number of researchers and scientists. This book, first published in 2002, focuses on the materials science of MEMS structures and the films involved to create those structures. Topics include: applications metrology; mechanical properties; microstructure and processing; applications; processing techniques; alternative materials; and surface engineering issues in MEMS structures and devices.
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ThreeDimensional Thermal Effects in MEMS Devices
Piezoelectric Shear Mode Inkjet Actuator
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2002 Materials Research 3D feed horn Actuators analysis annealing applied array bond bulk micromachining calculated ceramic chamber components crevice corrosion crevice former crystal delamination density detector developed diaphragms dielectric electrode etching eutectic eutectic layer experimental failure feed horn ferroelectric films deposited frequency function geometry glass gold grain Hoya SD-2 hydrogen indentation integration laser load material strength Materials Research Society measured mechanical membrane MEMS MEMS antenna MEMS devices MEMS structures metal micro micro-rocket Microelectromechanical Systems microfabrication microfluidic micromachining microstructure modulus mold NEMS neutron notch optical oxide panel parameters photoresist Phys piezoelectric polymer polysilicon pressure Proc properties Pyrex PZT film range ratio residual stress resonance sample shear shown in Figure shows silicon nitride silicon wafer simulations sol-gel specimen spectrometer stictioned strain stress concentration surface Symp technique TFTs thermal thick film thin films tonpilz voltage wavelength Weibull wire bond Young's modulus