Proceedings European Hybrid Microelectronics Conference 1979, Ghent, Belgium, May 21, 22 & 23, 1979 |
Contents
A Rating Criterion for Film Resistors H T Law | 9 |
F Sleeckx T Naten A Van de Capelle and J Vandewege | 88 |
Effects of Refiring Processes on Electrical and Structu | 241 |
Copyright | |
4 other sections not shown
Common terms and phrases
adhesion Alphamet alumina aluminium applications AR/R AuAl ball bonds capacitance capacitors CC-packages ceramic cermet chips coating components conductivity Conference 1979 current noise curve dependence devices dielectric dissipation dissipation factor effect electrical electronic encapsulated epoxy Erie etching evaporated experimental factor Figure filter firing cycles firing temperature frequency function Ghent glass heat hybrid circuit IEEE increase input insulator integrated circuits L-cut layer lead frame manufacturers material measured mechanism mesh metal microcircuits Microelectronics NiCr obtained oxide package paper parameters particles pattern performance plastic preamplifier printed circuit board Proc produced properties range refiring screen printing semiconductor sensor sheet resistivity shown in Fig shows silicon sintering solar cell solder sputtering stability steel structure substrate TABLE technique thermal thick film resistors thin film thin film transistor transistors trimming tuning ultrasonic voltage wedge bonds welding wire bonding