Handbook of Microlithography, Micromachining, and Microfabrication, Band 2IET, 1997 - 692 Seiten This volume concentrates on the process technology and device applications associated with micomachining and microfabrication. The handbook is intended primarily for industrial laboratories, universities and manufacturing facilities. |
Inhalt
MICROMACHINING AND TRENDS FOR THE TWENTYFIRST CENTURY 3 | 31 |
| 41 | |
CHAPTER 2 | 43 |
8 | 82 |
9 | 88 |
APPLICATIONS OF DRY ETCHING TO MICROSENSORS FIELD EMITTERS | 99 |
FOCUSED ION BEAMS FOR MICROMACHINING AND MICROCHEMISTRY | 153 |
PLATING TECHNIQUES | 197 |
Micromechanical Machining Processes | 325 |
3 | 345 |
Development of Ceramic Microcomponents | 360 |
References | 369 |
SENSORS AND ACTUATORS | 379 |
MICROOPTICAL DEVICES | 435 |
MICROMACHINED SYSTEMS FOR NEUROPHYSIOLOGICAL APPLICATIONS | 517 |
THINFILMTRANSISTORADDRESSED LIQUID CRYSTAL DISPLAYS | 571 |
Suggested Further Reading | 288 |
HIGH ASPECT RATIO PROCESSING | 299 |
2 | 303 |
MICROSENSORS ACTUATORS MEMS AND ELECTRONICS FOR SMART STRUCTURES | 617 |
| 689 | |
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Handbook of Microlithography, Micromachining, and Microfabrication ... P. Rai-Choudhury Eingeschränkte Leseprobe - 1997 |
Häufige Begriffe und Wortgruppen
accelerometer achieved anisotropic etching applications array aspect ratio biomedical bulk micromachining cantilever capacitance cathode chemical chip circuitry CMOS concentrations conductors current density deposition developed devices dielectric diffusion dry etching ECR source effect Electrochem electrodeposition electroforming electroless electron electroplating emitter tips etch rate etchants fabrication fiber Figure Focused Ion Beam frequency high aspect ratio IEEE implantable increased integrated circuit ion beam L.T. Romankiw laser magnetic material mechanical membrane MEMS metal Micro microelectronics micromachining technologies microstructures microwave power mirrors mold mTorr optical optical fiber output oxide pattern Permalloy photoresist piezoelectric planar plasma plating solution PMMA polyimide polymer polysilicon pressure Proc produce removed resist resonant rf power seed layer Sensors and Actuators shown in Fig sidewall signal silicon SiO2 Solid-State Sensors sputtering structures substrate surface micromachining techniques temperature thermal thin film transducers typically vertical voltage wafer waveguide x-ray lithography µm wide