Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1975 - Microelectronics |
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Page 67
... input board . It is housed in two aluminum boxes with the inside box thermally insulated from the outer box . temperature in this region is sensed by the platinum resistance thermometer ( PRT ) , shown at the bottom of the reference ...
... input board . It is housed in two aluminum boxes with the inside box thermally insulated from the outer box . temperature in this region is sensed by the platinum resistance thermometer ( PRT ) , shown at the bottom of the reference ...
Page 205
... Input Pattern Generator To Inputs Interconnection Functional Reference Device ( FRD ) Device Under Test ( DUT ) Fig . 1 . tester . Functional diagram for a general purpose , fixed logic controlled digital IC The matrix is implemented ...
... Input Pattern Generator To Inputs Interconnection Functional Reference Device ( FRD ) Device Under Test ( DUT ) Fig . 1 . tester . Functional diagram for a general purpose , fixed logic controlled digital IC The matrix is implemented ...
Page 209
... Input leakage measurements are usually made with VCCmax , VIH , and VIL applied to the appropriate DUT pins . The states of the input pins are then exercised using either the Gray counter or a programmed sequence . A voltage is forced ...
... Input leakage measurements are usually made with VCCmax , VIH , and VIL applied to the appropriate DUT pins . The states of the input pins are then exercised using either the Gray counter or a programmed sequence . A voltage is forced ...
Contents
Memory Devices | 1 |
Testing Problems Associated with a 4096 Bit MOS Memory by Don Knowlton | 8 |
A Testing Turnaround | 16 |
Copyright | |
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aluminum analysis application assembly Auger ball bond bipolar bonder ceramic chip conductor connector cost Cryoseal cycle diagnostic die attach diffusion electron EMCA energy epoxy equipment etching executive computer failure function glass gold plated hardware heat increase input integrated circuits Integrated Injection Logic interconnect interface ion implantation laser layer lead bonding logic machine manufacturers material memory metal method microcomputer microprocessor module molded multichip operation output oxide package pads parameters pattern performance photoresist pins plated frames plated lead frames Plessey polyimide print head production pulse push-off radiation reliability replacement resistance resistor sample seal SET F sheet resistance shown in Figure silicon silver migration silver plated lead solder substrate surface Table tape tarnish technique temperature tester thermal printer thermistor thermocompression thick film thin film threshold voltage transistors typical voltage volts wafer wire bonding