Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1975 - Microelectronics |
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Page 32
... performance , reproducibility and reliability . These are of utmost importance in microwave circuits . Performance The performance of the STD - Microwave technology has proven superior to existing " conventional " micro- strip using ...
... performance , reproducibility and reliability . These are of utmost importance in microwave circuits . Performance The performance of the STD - Microwave technology has proven superior to existing " conventional " micro- strip using ...
Page 72
... performance in integrated digital systems . Since all on - chip interconnections are determined strictly by logic design , it is of paramount importance that careful attention be given to horizontal geometry and layout , and vertical ...
... performance in integrated digital systems . Since all on - chip interconnections are determined strictly by logic design , it is of paramount importance that careful attention be given to horizontal geometry and layout , and vertical ...
Page 199
Table 1. Microcomputer application areas arranged by word length . MEDIUM PERFORMANCE HIGH PERFORMANCE PITFALLS TO AVOID IN APPLYING MICROPROCESSORS by L.J. Mandell Litton. WORD LENGTH GENERAL CLASSIFICATION BY FUNCTION LOW PERFORMANCE 4 ...
Table 1. Microcomputer application areas arranged by word length . MEDIUM PERFORMANCE HIGH PERFORMANCE PITFALLS TO AVOID IN APPLYING MICROPROCESSORS by L.J. Mandell Litton. WORD LENGTH GENERAL CLASSIFICATION BY FUNCTION LOW PERFORMANCE 4 ...
Contents
Memory Devices | 1 |
Testing Problems Associated with a 4096 Bit MOS Memory by Don Knowlton | 8 |
A Testing Turnaround | 16 |
Copyright | |
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aluminum analysis application assembly Auger ball bond bipolar bonder ceramic chip conductor connector cost Cryoseal cycle diagnostic die attach diffusion electron EMCA energy epoxy equipment etching executive computer failure function glass gold plated hardware heat increase input integrated circuits Integrated Injection Logic interconnect interface ion implantation laser layer lead bonding logic machine manufacturers material memory metal method microcomputer microprocessor module molded multichip operation output oxide package pads parameters pattern performance photoresist pins plated frames plated lead frames Plessey polyimide print head production pulse push-off radiation reliability replacement resistance resistor sample seal SET F sheet resistance shown in Figure silicon silver migration silver plated lead solder substrate surface Table tape tarnish technique temperature tester thermal printer thermistor thermocompression thick film thin film threshold voltage transistors typical voltage volts wafer wire bonding