Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1975 - Microelectronics |
From inside the book
Results 1-3 of 50
Page 31
... problems to light , problems that needed to be solved before the technique could be considered a finished process . They were : 1. The requirements for gold metallizing of the chips 2 . 3 . The high thermal impedance of chip - to ...
... problems to light , problems that needed to be solved before the technique could be considered a finished process . They were : 1. The requirements for gold metallizing of the chips 2 . 3 . The high thermal impedance of chip - to ...
Page 34
... problems have been overcome by carefully controlling the pressing step . ( In production , automatic control is possible . ) Air bubbles around the chip have been caused by gas generation from the polyimide siloxane during chip bonding ...
... problems have been overcome by carefully controlling the pressing step . ( In production , automatic control is possible . ) Air bubbles around the chip have been caused by gas generation from the polyimide siloxane during chip bonding ...
Page 190
... problems associated with this technique : a . Underplating This is defined as plating of a thin gold layer under the photoresist causing wider lines and in extreme cases shorts . An example of minor underplating is shown in Figure 8 . b ...
... problems associated with this technique : a . Underplating This is defined as plating of a thin gold layer under the photoresist causing wider lines and in extreme cases shorts . An example of minor underplating is shown in Figure 8 . b ...
Contents
Memory Devices | 1 |
Testing Problems Associated with a 4096 Bit MOS Memory by Don Knowlton | 8 |
A Testing Turnaround | 16 |
Copyright | |
16 other sections not shown
Other editions - View all
Common terms and phrases
aluminum analysis application assembly Auger ball bond bipolar bonder ceramic chip conductor connector cost Cryoseal cycle diagnostic die attach diffusion electron EMCA energy epoxy equipment etching executive computer failure function glass gold plated hardware heat increase input integrated circuits Integrated Injection Logic interconnect interface ion implantation laser layer lead bonding logic machine manufacturers material memory metal method microcomputer microprocessor module molded multichip operation output oxide package pads parameters pattern performance photoresist pins plated frames plated lead frames Plessey polyimide print head production pulse push-off radiation reliability replacement resistance resistor sample seal SET F sheet resistance shown in Figure silicon silver migration silver plated lead solder substrate surface Table tape tarnish technique temperature tester thermal printer thermistor thermocompression thick film thin film threshold voltage transistors typical voltage volts wafer wire bonding