Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1975 - Microelectronics |
Contents
Memory Devices | 1 |
Testing Problems Associated with a 4096 Bit MOS Memory by Don Knowlton | 8 |
A Testing Turnaround | 16 |
Copyright | |
16 other sections not shown
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Common terms and phrases
aluminum analysis application assembly Auger ball bond bipolar bonder ceramic chip conductor connector cost Cryoseal cycle diagnostic die attach diffusion electron EMCA energy epoxy equipment etching executive computer failure function glass gold plated hardware heat increase input integrated circuits Integrated Injection Logic interconnect interface ion implantation laser layer lead bonding logic machine manufacturers material memory metal method microcomputer microprocessor module molded multichip operation output oxide package pads parameters pattern performance photoresist pins plated frames plated lead frames Plessey polyimide print head production pulse push-off radiation reliability replacement resistance resistor sample seal SET F sheet resistance shown in Figure silicon silver migration silver plated lead solder substrate surface Table tape tarnish technique temperature tester thermal printer thermistor thermocompression thick film thin film threshold voltage transistors typical voltage volts wafer wire bonding