Proceedings of the ... International Microelectronics Symposium |
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Contents
Memory Devices The Users Viewpoint by William H Evans | 1 |
Testing Problems Associated with a 4096 Bit MOS Memory by Don Knowlton | 8 |
Cost of Multichip Assemblies by Dr John M Salzer | 25 |
Copyright | |
14 other sections not shown
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aluminum analysis application assembly bipolar bonder boron ceramic chip conductor connector cost Cryoseal cycle developed device type diffusion electrical Electronic energy epoxy equipment etching executive computer failure failure analysis functional glass gold plated hardware increase input integrated circuits Integrated Injection Logic interconnect interface ion implantation laser layer lead bonding logic machine manufacturers material memory metal method microcomputer microelectronic microprocessor module molded multichip operation output oxide package pads parameters pattern performance photoresist pins plated frames plated lead frames polyimide print head printed circuit board problems production pulse radiation reliability replacement resistance resistor sample seal sheet resistance shown in Figure silicon silver migration silver plated lead solder substrate surface Table tape tarnish technique temperature tester thermal printer thermistor thermocompression thick film thin film threshold voltage transistors typical voltage volts wafer wire bonding