Microelectronic Structures and MEMS for Optical Processing, Volume 3513SPIE--The International Society for Optical Engineering, 1998 - Microelectronics |
Contents
Finding markets for microstructures 3513202 | 17 |
Micromachining technologies for miniaturized communication devices 3513203 | 24 |
Novel beamsteering micromirror device 351302 | 40 |
Copyright | |
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alignment aluminum amplifiers applications assembly beam bottom electrode cantilever capacitance circuit components conductive polymer conductive polymer bumps coupling coupling loss deformable mirror deposition diaphragm diffraction electrical electrode electroplating electrostatic force etching evanescent field fabrication process fiber optic film filter flip-chip flip-chip bonding frequency hinge hydrogen IEEE injection molding input integrated lens lenses light modulator lithography mask material measured mechanical membrane MEMS for Optical metal method micro SLM microassembly Microelectronic Structures micromirror device microstructures mirror plate MOEMS optical elements optical fibers optical systems output oxide package pattern phase photodetectors photodiode photoresist piezoelectric pinhole polysilicon probe Proc reflection reshaped residual stress resonator sacrificial layer schematic Sensors and Actuators September 1998 SPIE shape shown in figure shows silicon simulation SiO2 spatial light modulator Structures and MEMS substrate surface micromachining switches techniques temperature TFAMA thermal thickness transducer upper electrode V-grooves vapor vertical torsion mirror wafer waveguide wavelength