Ire Bonding in Microelectronics: Materials, Processes, Reliability, and YieldThe wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding inMicroelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichipmodules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism. |
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Bibliographic information
| Title | Ire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield McGraw-Hill Electronic Packaging and Interconnection Series |
| Author | George G. Harman |
| Edition | 2, illustrated |
| Publisher | McGraw-Hill, 1997 |
| ISBN | 0070326193, 9780070326194 |
| Length | 290 pages |
| Subjects | › › › Technology & Engineering / Electrical Technology & Engineering / Electronics / Circuits / General Technology & Engineering / Electronics / Microelectronics Technology & Engineering / Materials Science |
| Export Citation | BiBTeX EndNote RefMan |