Control in Electroplating: A One-day Symposium |
Contents
THE CHEMICAL CONTROL OF PLATING ELECTROLYTES | 3 |
THE CONTROL OF ELECTRODEPOSITION PROCESSES | 21 |
TROUBLESHOOTING IN THE PLATING SHOP | 51 |
Copyright | |
1 other sections not shown
Common terms and phrases
acid addition agents adhesion aluminium alloys amp./sq anode anodising apparatus applied barium hydroxide basis metal brass bright nickel British Standard cadmium cathode caustic soda chromic acid chromium plating chromium solution cleaners coating contamination copper covering power current density end current density range D. W. SMITH degreased ductility dull E. A. OLLARD electrical electrodeposits electrolyte Electroplating equipment free cyanide gassing give high current density Hull Cell inspection instrument laboratory layer corrosion low current density materials measuring metallic impurities micro-inches Ministry of Supply nickel deposit nickel solutions nitric acid normal obtained operation particularly pitting plated article plating bath plating chemist plating solution polishing pores porosity potassium ferricyanide production requirements rinse roughness samples Semi-bright smooth sodium chloride solution analysis solution control specifications specimen spray stainless steel strip suitable sulphate sulphur supply houses tank temperatures tester thickness testing thin titration trouble Trouble-shooting vapour corrosion zinc