Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1976 - Microelectronics |
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adhesion alloy alumina aluminum applications assembly ball bond bump capacitors ceramic Cermalloy chip carrier coefficient components composition conductivity conductor materials copper cost curing curves cycle devices dielectric DuPont effect electrical Electronic epoxy etched evaluated fabrication failure firing frequency function glass gold hybrid circuits hybrid microcircuits hybrid microelectronics inch increase indium integrated circuits interconnection interface ISHM laser trimming layer lead manufacturing materials measured mechanical metal method micro module multilayer networks noise operation output oxide package pads parameters paste percent performance photoresist plated polyimide printed production properties pulse reliability resistor samples screen semiconductor shear rate sheet resistivity shown in Figure shows solder strength stress substrate surface Table techniques temperature thermal thick film thick film resistors thin film tion transistors typical ultrasonic viscosity voltage width wire bonding