Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1976 - Microelectronics |
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Page 123
... noise design of thick film resistors is presented in this paper . A noise model is verified by experimentation for two resistive inks , one a ruthenuim based ink and the other an iridium based ink . For both inks , a constant is ...
... noise design of thick film resistors is presented in this paper . A noise model is verified by experimentation for two resistive inks , one a ruthenuim based ink and the other an iridium based ink . For both inks , a constant is ...
Page 230
... noise and Si - rich image with the reproduced specimen . From this study , it is concluded that the impulse noise in thick film resistors is caused directly by the defect in the film and generated by resistance fluctuation near the ...
... noise and Si - rich image with the reproduced specimen . From this study , it is concluded that the impulse noise in thick film resistors is caused directly by the defect in the film and generated by resistance fluctuation near the ...
Page 238
... noise increase after trimming and is , therefore , recommended for trimming low noise resistors . The experimental results indicated that the trimming process not only increases the resistor noise attrib- uted to the current crowding ...
... noise increase after trimming and is , therefore , recommended for trimming low noise resistors . The experimental results indicated that the trimming process not only increases the resistor noise attrib- uted to the current crowding ...
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1/f noise adhesion alloy alumina aluminum amplifier applications ball bond capacitor ceramic Cermalloy chip coefficient components composition conductance conductor conductor materials copper curing cycles devices dielectric DuPont effect electrical Electronic epoxy etched evaluated exposure fabrication failure firing frequency function glass gold heat hybrid circuits hybrid microcircuits hybrid microelectronics inch increase indium input integrated circuits interconnection interface ISHM kerf laser trimming layer manufacturing materials measured metal micro microelectronics microwave mils module multilayer networks noise operation output oxide package pads parameters particles paste percent performance photoresist plated polyimide printed production properties pulse reliability samples screen semiconductor shear strength sheet resistivity shown in Figure shows stability substrate surface Table techniques temperature thermal thermosonic thick film resistors thin film tion transistors typical ultrasonic voltage width wire bonding