Microelectronic Processing Technician Course Curriculum |
Contents
Chip Resistor Failures Associated with Solder Joint Degradation | 11 |
Solder Columns for Surface Mounting of Leadless Ceramic Chip | 17 |
Optimization of Solder Reflow with IR by Norman R Cox Research | 43 |
Copyright | |
18 other sections not shown
Common terms and phrases
adhesion alloy alumina alumina substrate aluminum analysis annealing applications assembly capacitance capacitors cell ceramic substrate chip carrier coefficient components conductivity conductor conventional copper cure cycling developed devices die attach dielectric constant dielectric resonator effect electrical Electronic epoxy etching fabrication fired film firing frequency furnace glass gold ground plane heat hybrid circuits increase insulation integrated circuits interconnect interface laser laser trimmed layout leakage current levels manufacturing material measured metal method Microelectronics microstrip multilayer ND ND ND noise ohms operation OVCC oxide package pads parameters pattern performance phase photoresist plating polyimide polymer production resistors robot samples screen printing scribe seal shear sheet resistivity shown in Figure shows silicon silver simulation solder joint squeegee substrate Table tape techniques temperature thermal thick film thin film tion transistor trimmed values voltage wire bonding