The Electronics Assembly Handbook

Front Cover
Frank Riley, Electronic Packaging and Production
Springer Science & Business Media, Jun 29, 2013 - Technology & Engineering - 603 pages
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The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
 

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Contents

CHAPTER3 COMPONENT INSERTION
3
CHAPTER 2CIRCUIT BOARDS
12
Cleaning PCBs for higher quality
25
ChiponBoard
39
Adhesives
50
T Thompson
64
Automated placement techniques
79
Robot hand exchangers
99
Cullen J Field and J Payne
180
Conductive epoxy for SMT solder replacement
195
CHAPTER 5HYBRID CIRCUITS
206
Soldercleaning test and rework
221
Soldering system trends
239
Optimizing the wave soldering process
252
Adhesives for SMD wave soldering
275
Screen printing
293

Robotic Application
112
CHAPTER 4SURFACEMOUNTTECHNOLOGY
123
Designing reliability into surfacemount assemblies
137
Choosing SMT and setting up a facility
150
Pickandplace machines
163
Rosin solder flux residues
309
Cleaning surfacemounted assemblies
324
CHAPTER 7TESTAND INSPECTION
340
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