Technology of Integrated Circuits

Front Cover
Springer Science & Business Media, Mar 9, 2013 - Technology & Engineering - 342 pages
Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.
 

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Contents

Introduction
1
Lithography
95
Electron lithography
145
Etching technology 169
168
Doping technology
207
Cleaning technology
235
Process integration
249
References
323
Subject Index
329
Copyright

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