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aging alpha emission alpha flux alpha particles Alphamet alumina aluminum BTAB capacitance capacitors carrier ceramic characteristics chip circuit coated components conductor connector contamination copper cycle decrease density deposition devices dew point dielectric effect electrical electronic enamel etching evaluated fabrication failure mode failure rate fired film firing frequency furnace glass hybrid hybrid circuits IEEE increase initial integrated circuits interconnection interface layer lead leakage load Manufacturer materials measured mechanical metal MOSFETs NDPT operation oxide package parameters partial discharge pattern peak percent phase plated porcelain printed pull strength pull test Q factor range reliability resistors samples semiconductor sheet resistivity shown in Figure shows silicon soft error solder structure substrate surface Table tantalum tape technique terminal thermal thermode thick film thin film thorium tion ultrasonic uranium values voltage welding wire bonding