29th Electronic Components Conference, Cherry Hill Hyatt House, Cherry Hill, N.J., May 14-16, 1979 |
Contents
MANUFACTURING PROCESS TECHNOLOGY | 1 |
Improvement of Firing Process in Thick Film | 11 |
Critical Study of Furnace Atmospheres | 15 |
Copyright | |
22 other sections not shown
Common terms and phrases
alpha alpha particles Alphamet alumina aluminum burnout section capacitance capacitors carrier ceramic characteristics chip circuit coating components conductor connector copper cycle CYLINDER AIR decrease density deposition devices DEW POINT DIEGO dielectric dielectric constant dielectrically isolated DUPONT effect electrical electronic enamel etching fabrication failure mode fired film firing frequency function furnace gate glass gold bump hybrid hybrid circuits IEEE impedance increase input integrated circuits interconnection interface layer lead load materials measured metal microstrip milliohms MOSFET ohms operation opto-isolators oxide package parameters pattern percent photoresist plated POLYOLIFIN porcelain printed pull strength Q factor range resistor ROOF AIR samples SCFH sheet resistivity shown in Figure shows socket soft error solder steel structure substrate surface Table tape technique terminal thermal thermode thick film thin film tion transistor voltage welding width wire bonding