Laser Processing: Fundamentals, Applications, and Systems Engineering : 3-6 June 1986, Québec City, CanadaW. W. Duley, Robert Weeks |
Contents
APPLICATIONS IN THE SEMICONDUCTOR INDUSTRY | 71 |
PROCESSING WITH CW LASERS | 111 |
KEYNOTE ADDRESS | 179 |
Copyright | |
3 other sections not shown
Common terms and phrases
a-Si absorbed absorption Acoustic Mirror alloy amorphous amplifier annealing applications argon austenite axis beam delivery beam divergence calculated Cambot cavity chromium clad CO2 laser components coupling coefficient cutting pressure decreases density diameter dye laser effect electron energy epitaxial excimer laser experimental fiber films fluences focused furnace annealing high power implanted increase industry input intensity interaction interface laser alloyed laser beam laser cutting laser irradiation laser power laser processing laser pulse laser radiation laser robotic system laser system laser welding lens machine martensite maximum measurements melt depth metal microstructure mirror nozzle operation optical output parameters Phys plasma plate preform production pulsed laser reflectivity region robot sample scanning shielding gas shown in Figure signal silicon solid phase steel substrate surface target techniques thermal thick vapor velocity wafers wear resistance welding speed width workpiece Wref zone