Solder Mechanics: A State of the Art AssessmentD. R. Frear, Wendell Bruce Jones, K. R. Kinsman |
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Contents
PHYSICAL METALLURGY OF SOLDER | 1 |
PHYSICAL METALLURGY | 31 |
HOT DEFORMATION OF TWO PHASE | 107 |
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304 stainless steel activation energy applications behavior cavitation cavity chapter CHMT Coffin-Manson component composition constitutive equations crack growth rate crack initiation crack tip creep-fatigue cycles to failure cyclic damage diffusion ductility effect Electronic Packaging engineering Equation eutectic solder experimental fatigue crack fatigue tests fracture mechanics Frear frequency geometry grain boundary heterogeneous coarsened high-Pb homologous temperature IEEE inelastic strain interface intergranular intermetallic compounds intermetallic growth isothermal fatigue loading low strain Metall metallurgical micrographs microstructure multiaxial number of cycles observed parameters Pb-rich phase diagram plastic strain precipitation Proc reaction reliability Sandia National Laboratories shear strain shown in Figure Sn-Pb eutectic alloy solder alloys solder joints Solder Mechanics specimen strain range stress relaxation structure substrate superplastic surface temperature tensile hold ternary thermal cycling thermal fatigue thermomechanical fatigue thickness total strain Trans type 304 stainless Vaynman Well-Characterized Material wettability wetting