Proceedings of the 1988 International Symposium on Microelectronics: October 17-19 1988, Washington State Convention and Trade Center, Seattle, Washington |
Contents
Williams E Loeb Ph D LOEB AND ASSOCIATES | 1 |
Jerry Boogaard ELECTRO SCIENTIFIC INDUSTRIES | 7 |
145 | 27 |
Copyright | |
16 other sections not shown
Common terms and phrases
adhesion AIN substrates alumina aluminum analysis applications assembly automation ball bond binder capacitor ceramic ceramic substrate characteristics chip coefficient cofired components compound bonds conductor copper cost density developed devices dielectric constant dissipation factor DuPont effect electrical electronic epoxy equipment evaluation fabrication failure Ferro fired frequency furnace glass gold heat hybrid circuit Hybrid Microelectronics increase integrated interconnection interface ISHM laser laser trimming layer manufacturing material measured mechanical metal method microcircuit Microelectronics microns module multilayer oxide package pads parameters particles pattern performed phase photoresist plated polyimide reliability resistor sample SAN DIEGO sensor shear sheet resistance shown in Figure signal silicon solder joint solder paste stress structure substrate superconductive surface Table tape technique thermal conductivity thick film thick film resistors thin film trimming voltage wire bonding