Analysis of Gap Heating Due to Stepped Tiles in the Shuttle Thermal Protection SystemNational Aeronautics and Space Administration, Scientific and Technical Information Branch, 1983 - Aerodynamic heating - 96 pages |
Contents
SUMMARY | 1 |
INCOMPRESSIBLE STEADY FLOW MODEL | 10 |
TRANSIENT THERMAL MODEL | 20 |
3 other sections not shown
Common terms and phrases
aluminum substrate angle approximately bond line bottom boundary condition boundary layer boundary-layer thickness Category compressible flow conductance for flow conductors Convection displacement thickness downstream energy equation equation for mass extent of separation filler bar filler-bar charring filler-bar temperature flow conditions flow model flow per unit forward-facing steps fuselage location gap between tiles gap filler gap flow gap heating Gap temperatures gap width incompressible initial gap input temperatures laminar boundary layer laminar flow Mach number mass flow rate mass transfer plateau pressure Ploc pressure distributions pressure disturbances Radiation represent Reynolds number Scor sec Figure Seff shown in figure shows nodes Shuttle orbiter Silicone-rubber membrane static pressure static temperature stepped tile STS-1 entry Subject tile surface temperature temperature distribution THERM thermal analysis thermal model thermal protection system tile deflection tile step height tile-to-tile gap turbulent boundary layer unit area upstream wing location