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Reinforcement of Mouldings
CopperClad Laminates for Use as Printed Circuit Boards
12 other sections not shown
acetate acid acrylic addition adhesive aluminium applied areas artefacts binder bonded calender carbon cellulose nitrate chemical coating flows colour components composition Conservation containing copolymer cross-linking curing degradation dispersions electrical electrical insulation employed epoxy resin esters evaporation example extrusion fabric Figure fillers film thickness finish flexible Flexography fluid formaldehyde formulation give glass fibre grades gravure heat impregnated industry injection moulding inks ketone lacquer laminates layer liquid machine manufacture material mechanical melt metal method mixing molecular weight Museum packs paint paper phenolic pigment plastic plate poly(vinyl chloride polyamide polyester polyethylene polymer polymerization polypropylene polyurethane Postprints powder pressure printing problems properties range reaction reinforcement resistance rigid roll roller rubber shear sheet soluble solution solvent speed spray strength substrate suitable surface synthetic technique temperature thermoplastic thermosetting typical urea-formaldehyde usually veneers vinyl viscosity wood