Plastics and Resin CompositionsWilfred Gordon Simpson |
Contents
Reinforcement of Mouldings | 27 |
HighPressure Laminates | 54 |
CopperClad Laminates for Use as Printed Circuit Boards | 74 |
Copyright | |
12 other sections not shown
Common terms and phrases
acid acrylic addition adhesive aluminium applied areas artefacts binder blade bonded calender carbon cellulose nitrate chemical coating flows colour components composition Conservation containing copolymer cross-linking curing degradation dispersions electrical electrical insulation employed epoxy resin esters evaporation example extrusion fabric Figure fillers film thickness finish flexible Flexography fluid formaldehyde formulation give glass fibre grades gravure heat impregnated industry injection moulding ketone lacquer laminates layer liquid machine manufacture material mechanical melt metal method mixing molecular weight Museum oxide packs paint paper phenolic pigment plastic plate poly(vinyl chloride polyamide polyester polyethylene polymer polymerization polypropylene polyurethane Postprints powder pressure printing properties range reaction reinforcement resistance rigid roll roller rubber shear sheet soluble solution solvent speed spray strength substrate suitable surface synthetic technique temperature thermoplastic thermosetting treatment typical urea-formaldehyde usually veneers vinyl viscosity wood