Electroless plating: fundamentals and applicationsG. O. Mallory, J. B. Hajdu Cambridge University Press, 01.01.1990 - 539 Seiten |
Inhalt
Preface | 1 |
Chapter 3 | 101 |
Chapter 5 | 139 |
Chapter 6 | 169 |
Chapter 7 | 193 |
Chapter 8 | 207 |
Chapter 9 | 229 |
Chapter 10 | 261 |
Electroless Plating of Gold and Gold Alloys | 401 |
Chapter 16 | 421 |
Chapter 18 | 463 |
Peter Berkenkotter and Donald Stephens | 481 |
Chapter 19 | 511 |
Waste Treatment of Electroless Plating Solutions | 519 |
| 529 | |
Andere Ausgaben - Alle anzeigen
Electroless Plating: Fundamentals and Applications Glenn O. Mallory,Juan B. Hajdu Eingeschränkte Leseprobe - 1990 |
Häufige Begriffe und Wortgruppen
activation addition adhesion agitation alkaline alloys aluminum anodic applications ASTM atoms autocatalytic borohydride boron carbon catalytic cathodic chemical chloride cleaning cobalt coercivity complexing agents components composition concentration containing copper deposition corrosion corrosion resistance current density decrease deposition rate DMAB effect Electrochem electroless copper electroless nickel coatings electroless nickel deposits electroless nickel plating electroless nickel solutions electroless plating electrolytic electrons electroplating etch ethylenediamine film filter formaldehyde gold heat treatment hydrazine hydrogen hydroxide hypophosphite immersion increase layer ligand magnetic materials mechanism mixed potential Ni-B Ni-P deposits nickel ions nitric acid operating oxidation palladium particles percent phosphite phosphorus phosphorus content plating bath plating process plating rate plating reaction plating solution polarization curves polypropylene produced pump reducing agent replenishment result salt sodium sodium hypophosphite stabilizer stress substrate sulfuric acid surface Table tank temperature thickness thiourea typical U.S. patent Water rinse zinc zincating µm/hr