Integrated Optoelectronics

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Mario Dagenais, Robert F. Leheny, John Crow
Academic Press, 1995 - Integrated circuits. - 686 pages
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Integrated optoelectronics is becoming ever more important to communications, computer, and consumer industries. It is the enabling technology in a variety of systems, ranging from low-cost, robust optical componentsin consumer electronics to high-performance broadband information networks capable of supporting video and multimedia conferencing. The requirements for producing low-cost, highly reliable components for deployment in these new systems have created a technology challenge. Integrated optoelectronics promises to meet the performance and cost objectives of these applications by integrating both optical and electronic components in a highly functional chip. This book provides an overview of this exciting newtechnology. Integrated Optoelectronics brings together a group of acknowledged experts from both universities and industry around the world to focus on a common theme of integration. These experts have reported not only on the state-of-the-art, but also on the physics and design experience that goes into implementing integrated chips and modules. This book is a cohesive series of articles that includes a discussion of the intimate trade-offs between materials, processes, devices, functional blocks, packaging,and systems requirements in a truly integrated technology. This integration encompasses electrical, optoelectronic, and optical devices onto monolithic or hybrid chips, and into multichip modules. This volume surveys state-of-the-art research activities in integrated optoelectronics and gathers most of the important references into a single place. It outlines the major issues involved in integrating both optical and electronic components, provides an overview of design and fabrication concepts, and discusses the issues involved in bringing these new chips to the marketplace. This exciting new book: Provides a broad overview of the optoelectronic field, including materials processing, devices, and systems applications Features authors who are acknowledged research experts in this field, from both industry and universities around the world Includes new information on device fabrication, including the latest epitaxial growth and lift-off techniques to permit the mixing of dissimilar materials onto single chips Covers planar processed laser fabrication leading to wafer level automated testing Discusses optimization of devices for integration, including a detailed treatment of the vertical emitting laser and theoretical and experimental coverage of optimization of photodetectors for integration into receiver chips Describes design approaches for multifunctional chips, including photonic circuits for all-optical networks and the design of integrated optoelectronic chips with lasers, photodiodes, and electronic ICs Covers the infrastructure needed to support an integrated technology, including automated design systems which treat both optical and electrical circuits, and multichip packaging approaches for both optical and IC chips

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