Proceedings of the ... International Symposium on MicroelectronicsInternational Society for Hybrid Microelectronics, 1994 - Hybrid integrated circuits |
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adhesion alumina analysis applications aramid assembly attach beryllia boron carbide BSCCO bump capacitance capacitors ceramic circuit cofired components composite conductivity conductor configuration copper cost cycle density deposition detected developed devices diamond die attach dielectric constant dry ice effect electrical Electronics epoxy etch fabric fired flip chip flux frequency glass gold Green Tape gyroscope heat hermetic hybrid Hybrid Circuit interconnect interface ISHM laminate laser layer manufacturing mask materials MCM-D MCM-L measured metal method Microelectronics Multichip Modules multilayer nichrome oxide package pads parameters particles pattern performance photoresist polyimide printed probe Proc properties reduced resistor samples semiconductor shear shown in Figure shows shrinkage silicon silver sintering solder specimen stencil strength structure substrate superconducting surface mount Table technique temperature thermal expansion thermal resistance thick film thin film transmission line vias vibration voltage weld wetting wire bonding