1995 International Symposium on Microelectronics: Proceedings : 24-26 October, 1995, Los Angeles Convention Center, Los Angeles, California, Volume 2649

Front Cover
ISHM-The Microelectronics Society, 1995 - Microelectronics - 562 pages
0 Reviews

From inside the book

What people are saying - Write a review

We haven't found any reviews in the usual places.

Contents

Hard Ball Grid Arrays for Pluggable BGA I
1
on Pop Corn 077 AlSiC Technology for Reliable and Thermally Demanding
18
Voiding Mechanism in BGA Assembly 083 Metal Impregnated Carbon Composites
24
Copyright

33 other sections not shown

Other editions - View all

Common terms and phrases

Bibliographic information