Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium: Proceedings : 2000 IEMT Symposium : October 2-3,2000, Santa Clara, CA, USA

Front Cover
IEEE, 2000 - Technology & Engineering - 388 pages

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Contents

Breakdown Voltages Phenomena at Molding CompoundChip Interface
1
Embedding of Electronics within Thermoplastic Polymers using
10
Industrial FlipChip Process for CSP3D from Design to Manufacturing
19
Copyright

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