Fracture of Materials: Moving Forwards : Proceedings of the International Workshop on Fracture of Materials: Moving Forwards, 23-25 Janurary 2006 in Sydney, Australia
Hong-Yuan Liu, Xiaozhi Hu, Mark Hoffman
Trans Tech Publications, 2006 - Technology & Engineering - 385 pages
The proceedings included overviews and recent investigations related to advanced structural metallic, ceramic and composite materials. The topics included innovative processing, phase transformations, mechanical properties and the relationships between processing, microstructure and mechanical behavior. Professor Yiu-Wing Mai of the University of Sydney will celebrate his 60th birthday in the early 2006. This collection is dedicated to this special event in celebration of the achievements and contributions an extraordinary man has made towards the science of fracture and materials. The contributions presented have been classified into five categories: Fracture, Fatigue and Damage; Composites; Nano-composites; Biomaterials, Porous Materials, Ceramics and Concrete; and Indentation, Thin film and surface Treatment.
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2006 Trans Tech analysis atoms behavior brittle carbon ceramic CNTs coating coefficients compatibilizer composites compressive compressive stress concrete crack initiation crack tip creep damage delamination density displacement distribution ductility effect elastic modulus Engineering equations experimental failure fatigue fiber fibre films finite element flexural fractal fracture energy fracture mechanics fracture surfaces fracture toughness fragmentation test fretting wear function geometry grain homogeneous impact increase indentation interface end interphase Keywords laminate layer ligament linear loading materials matrix Mech mechanical properties method microcracks microstructure mode nanocomposites notch obtained organoclay parameters particles particles/voids phase plastic deformation polyethylene polymer PP/CNT region reinforced samples shear shown in Fig silicon simulation sisal solder specimen strain stress field stress intensity factors stress singularity structure substrate Technology temperature tensile strength tensile stress thermal thickness toughening Trans Tech Publications University of Sydney wedge angle Young's modulus z-pinning