Polymers for Microelectronics and Nanoelectronics, Volume 874

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Qinghuang Lin, R. A. Pearson, Jeffrey C. Hedrick
American Chemical Society, 2004 - Technology & Engineering - 335 pages
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Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.

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Contents

PPV Nanotubes Nanorods and Nanofilms as well
15
LayerbyLayer Assembly of Molecular Materials
30
Oxidative SolidState CrossLinking of Polymer Precursors
44
Copyright

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About the author (2004)

Qinghuang Lin is at IBM T. J. Watson Research Center. Raymond A. Pearson is at Lehigh University.

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