Polymers for Microelectronics and Nanoelectronics, Volume 874

Front Cover
Qinghuang Lin, R. A. Pearson, Jeffrey C. Hedrick
American Chemical Society, 2004 - Technology & Engineering - 335 pages
0 Reviews
Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.

From inside the book

What people are saying - Write a review

We haven't found any reviews in the usual places.


PPV Nanotubes Nanorods and Nanofilms as well
LayerbyLayer Assembly of Molecular Materials
Oxidative SolidState CrossLinking of Polymer Precursors

17 other sections not shown

Common terms and phrases

About the author (2004)

Qinghuang Lin is at IBM T. J. Watson Research Center. Raymond A. Pearson is at Lehigh University.

Bibliographic information