Advanced Materials for Thermal Management of Electronic PackagingThe need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging. |
Contents
| 1 | |
Characterization Methodologies of Thermal Management Materials | 59 |
Electronic Packaging Materials and Their Functions in Thermal Managements | 131 |
Monolithic Carbonaceous Materials and Carbon Matrix Composites | 168 |
Thermally Conductive Polymer Matrix Composites | 201 |
High Thermal Conductivity Metal Matrix Composites | 233 |
Thermally Conductive Ceramic Matrix Composites | 277 |
Thermal Interface Materials in Electronic Packaging | 305 |
Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks | 373 |
Liquid Cooling Devices and Their Materials Selection | 421 |
Thermoelectric Cooling Through Thermoelectric Materials | 476 |
Development and Application of Advanced Thermal Management Materials | 527 |
Standards and Specifications for Evaluation of Thermal Management in Electronic Industry | 594 |
| 607 | |
Other editions - View all
Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong Ph.D No preview available - 2013 |
Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong Ph.D No preview available - 2011 |
Common terms and phrases
adhesive alloys aluminum applications assembly boiling bonding carbon fibers ceramic chip circuit CNTs coating components composite materials convection cooling system copper cost density developed device diamond dielectric electrical conductivity electronic packaging energy enhanced fabrication filler film fins flip chip flow fluid foam function graphene graphite grease heat flux heat pipe heat sink heat spreader heat transfer coefficient high thermal conductivity improved increase infiltration insulating layer liquid cooling load low thermal manufacturing matrix composites mechanical melting metal method MMCs modeling module molding nanotubes operating optimal oxide particles phase change phonon plate preform pressure processor properties range reduce reinforced reliability resin result semiconductor silicon sintering solder solution stress structure substrate surface techniques temperature thermal conductivity thermal design thermal expansion thermal grease thermal interface materials thermal management thermal performance thermal resistance thermoelectric thermoelectric cooling thickness TIMs typically vapor